ASIC Failure Analysis Engineer

Must Have Technical/Functional Skills

• Bachelor’s in electrical/Electronics Engineering or related required. Master's Preferred
• 5+ years of experience in failure analysis field (preferably semiconductor).
• Semiconductor technology and process knowledge (Fab, Assembly, and Advanced Packaging).
• Should have good knowledge and understanding of the Failure Analysis Techniques used in the nanometer semiconductor manufacturing technologies like 14nm, 10nm, 7nm, etc.
• Knowledge on FA techniques like Cross sectioning, X-ray, CSAM, TDR, FIB, SEM, and TEM is required.
• Fundamental knowledge of fault isolation technique, ATE, Scan/ATPG debug preferred.
• Good understanding of transistor functions and basic electronics.
• Knowledge of JEDEC IC Qualification tests and requirements is beneficial.
• Innovative and Creative with troubleshooting techniques.
• Enjoy hands-on work and working in a lab environment.
• Good customer and vendor management skills.

· Ability to work well in cross-functional teams in a fast-paced, collaborative team environment.

· Ability to work independently, multi-task, and pay good attention to details.

Experience Required

• 5+ years of experience in failure analysis field (preferably semiconductor), Semiconductor technology and process knowledge (Fab, Assembly, and Advanced Packaging).

Roles & Responsibilities

• Conduct Root cause analysis of reliability tests or field failures and propose corrective act ions.

·Develop and implement standard processes for failure analysis.

• Coordinate all the logistics and instructions to direct the failure analysis process and carry out FA function in a systematic way.

·Document and report failure analysis results to management.

• Function as a technical resource for failure analysis questions.

·Develop and maintain relationships with vendors and suppliers.

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