Senior Flip-Chip BGA Package Designer – SerDes & RFAdvanced Technology Search • Fort Collins, CO, United States
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Senior Flip-Chip BGA Package Designer – SerDes & RF
Advanced Technology Search • Fort Collins, CO, United States
[job_card.30_days_ago]
[job_preview.job_type]
- [job_card.full_time]
[job_card.job_description]
A leading technology recruitment firm is seeking an experienced Package Design Engineer in Fort Collins, Colorado. This role involves designing complex flip-chip-BGA packages, particularly for ASICs in high-speed SerDes and RF communications. The ideal candidate has over 12 years of relevant experience and strong skills in Cadence tools, collaboration, and project management. This position offers a chance to innovate within a worldwide R&D team focused on developing cutting-edge technologies.
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Senior FlipChip BGA Package Designer SerDes RF • Fort Collins, CO, United States
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