A company is looking for a Senior Package Layout Engineer - Hardware. Key Responsibilities Collaborate with design teams to implement high speed / density ASIC packages Optimize package pinout and perform substrate breakout patterns for ASIC packages Conduct design feasibility studies and develop methodologies to improve layout productivity Required Qualifications B.S. in Electrical Engineering or equivalent experience 5+ years of experience in PCB Layout of graphics cards, motherboards, or related technology Proven experience in substrate layout of wire bond and flip chip packages Significant background with Cadence APD or SiP and / or PCB layout tools Solid understanding of high-speed design signal integrity practices
Senior Engineer • Southport, Indiana, United States