A company is looking for a Senior Package Layout Engineer - Hardware.
Key Responsibilities
Collaborate with design teams to implement high-speed / density ASIC packages
Perform substrate breakout patterns and optimize package pinout
Conduct design feasibility studies and develop methodologies to improve layout productivity
Required Qualifications
B.S. in Electrical Engineering or equivalent experience
5+ years of experience in PCB Layout of related technologies
Proven experience in substrate layout of wire bond and flip chip packages
Significant background with Cadence APD or SiP and / or PCB layout tools
Solid understanding of high-speed design signal integrity practices
Senior Package Layout Engineer • Los Angeles, California, United States