Package Design EngineerGoldenpick Technologies • San Jose, California, USA

Package Design Engineer

Goldenpick Technologies • San Jose, California, USA

[job_card.variable_days_ago]

[job_preview.job_type]

[job_card.full_time]

[job_card.job_description]

Requirements / Skills :

Possess Mentor Graphics Cadence PLA knowledge
Multiple layers package design (8) experience
Understanding of substrate manufacturing design rule and assembly rule
Possess Flip Chip Package Design Concept
Good communication skill.
May require vendor on-site support

Key Skills

Load & Unload,Ruby,Shipping & Receiving,Forklift,Lift Truck Experience,Basic Math,Packaging,Warehouse Experience,Delivery Driver Experience,Heavy Lifting,Human Resources,RF Scanner

Employment Type : Full Time

Experience : years

Vacancy : 1

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