Packaging Design Engineer - Advanced Wafer-Level & OSAT Processes

Job Description

Job Description

We are seeking a highly skilled and experienced Packaging Design Engineer to lead the development of our next-generation semiconductor packaging solutions. This role is focused on the critical interface between our ICs and the final package, with a strong emphasis on advanced interconnects and outsourced semiconductor assembly and test (OSAT) management. You will be responsible for defining, developing, and qualifying high-reliability packaging processes, including but not limited to Through-Silicon Vias (TSVs), flip-chip bonding, mounting and wire bonding.

This is a key technical position where you will serve as the primary expert for wafer-level and package-level interconnects. You will work directly with our foundry partners to develop robust TSV processes and collaborate with OSATs to create and qualify cutting-edge assembly processes. Your expertise will be vital in ensuring our products meet the highest standards of performance and reliability, from initial design through to volume manufacturing.

Key Responsibilities

• Design & Collaboration : (1) Serve as the technical lead for all outsourced packaging activities, including the selection and qualification of OSAT partners for our specific product requirements. (2) Own the package-level design and material stack-up, making critical decisions on die attach methods, underfill, and molding compounds. (3) Provide technical guidance to internal design teams on package-level design rules and best practices to ensure optimal manufacturability and reliability.
• Wafer-Level Interconnects : (1) Work directly with foundry partners to define, develop, and qualify Through-Silicon Via (TSV) processes that meet our stringent electrical and reliability requirements. (2) Drive the DFM (Design for Manufacturability) of our electrical interconnects, ensuring the process is robust for high-volume production.
• Reliability and Qualification : (1) Define and implement robust reliability test methodologies to characterize and validate new packaging processes and designs. (2) Collaborate closely with the reliability engineering team to prove in all new package designs and processes through rigorous testing and data analysis. (3) Conduct failure analysis on packaging-related issues to identify root causes and implement corrective actions, continuously improving process robustness.

Minimum Qualifications

Preferred Skills

Starting salary and title will depend on, and be commensurate with, relevant experience, skills, training, education, market demands, and the ultimate job duties and requirements.

nEye is an Equal Opportunity Employer . All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.

We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.