Scientist, Mechanical Engineering (Electronics Packaging)

Job Title : Scientist Mechanical Engineering (Electronics Packaging)

Job Code : 32911

Job Location : Plano TX

Job Schedule : 9 / 80 (Every other Friday off!)

Relocation : Relocation assistance is available to qualified applicants

Job Description :

The Agile Development Group (ADG) specializes in developing disruptive next-generation technologies for advanced Unmanned Air Systems (UAS / UAV) advanced radar systems next-generation weapon systems and other RF sensor technologies using small company agility and big company experience. Team is seeking an Electronic Packaging Mechanical Engineer to work with a cross-functional team to develop design and implement radar systems. The position will follow the product from conceptualization through hardware integration and test. The position will interface with Designers Thermal / Structural Analysts Systems Engineers other engineering disciplines Program Managers and customer counterparts. The position will require leading the mechanical engineering activities related to the design analysis documentation fabrication assembly and qualification of product to the specification requirements typically with stringent technical schedule and process requirements. Candidate must have experience in 3D modeling critical HW design and development to include environmental requirements power delivery and aggressive thermal management. Candidate must have the ability to work independently and within a multi-disciplined team environment. Candidate must have experience leading team and pushing forward mechanical technologies.

Essential Functions :

• Proposal support and development
• Assist with developing overall site wide Mechanical strategy
• Work closely with cross-functional teams in the development of new solutions.
• Significant CAD modeling of parts & assemblies
• Perform trade studies to determine optimal designs
• Review Structural and thermal analysis of components & assemblies
• Have deep understanding of thermal management of high-power electronics in constrained volumes.
• Electromechanical integration and electronics packaging
• Lead mechanical design efforts
• Lead peer reviews PDRs CDRs and other required design reviews
• Schedule cost and technical responsibility at the major subsystem level
• Interface to customers & upper management
• Provide guidance and mentorship for other team members formally or informally
• Responsible for directing and reviewing the work of junior engineers and designers and technicians.
• Participate in risk assessment and develop mitigation strategies for complex projects
• Ability to obtain and maintain any additional clearances as required
• Proficiency in CAD tools such as Solidworks / Creo
• Take on roles such as IPT Lead when necessary

Qualifications :

Preferred Additional Skills :

Required Experience :

IC

Key Skills

HR Administration,Drafting,E Learning,Concrete Pump,Environment Health And Safety,Adobe Indesign

Employment Type : Full Time

Experience : years

Vacancy : 1