Semiconductor Process Integration Engineer

Overview We are seeking a full-time Semiconductor Process Integration Engineer with specialized expertise in inertial sensors in our Goleta, CA location. In this role, you will work with our scientists and engineers on the design, layout, and hands on fabrication of high performing devices. You’ll have the opportunity to develop and refine microfabrication processes, integrating them into a streamlined workflow that transforms ideas from design to prototype within an R&D environment. Essential Functions Serves as a project lead in a clean room environment, responsible for process development, process integration and device fabrication Responsible for defining specifications, establishing qualification and acceptance criteria, and managing project budgets and timelines Strong track record of process development, process optimization, design of experiments methodology, statistical data analysis and problem solving Ability to combine disparate process recipes into a full fabrication flow and understand the impact of process interdependence Possesses experience and process development expertise in contact / stepper photolithography, wet and plasma dry etches, high aspect-ratio deep reactive ion etching (DRIE) of silicon, glass and other relevant materials, chemical vapor deposition, dielectric and metal depositions, wafer bonding and vacuum encapsulation of microscale structures, sacrificial and structural layer creation and wet / dry release Ability to conduct metrology such as optical / infrared microscope inspections, interferometric measurements and scanning electron microscopy with elemental analysis is required. Collaborates closely with cross-functional teams including electrical engineers, mechanical engineers, and manufacturing teams Offers process improvement suggestions, authors new procedures, and provides technical input to product development plans and concept documents along with making substantial contributions toward determination of project goal / objective feasibility Demonstrated strong documentation skills in fabrication process development and experimental work Ability to modify and / or review mask layouts in CAD layout software such as Klayout Basic Qualifications Bachelor’s Degree in Electrical Engineering, Computer Engineering, Software Engineering or related field AND a minimum of 1 year relevant experience OR an equivalent combination of education and experience Excellent academics (cumulative GPA greater than or equal to 3.0 as a general rule) Demonstrated ability with application of design standards and procedures to design and develop moderately complex analog, digital and / or RF designs including simulations, schematics, PCB layouts and evaluation Demonstrated ability with electrical engineering tools Demonstrated knowledge of design impacts on manufacturability Desired Qualifications Back-end wafer process experience in wafer grinding, CMP, die singulation and assembly processes into packages is a plus. Experiences with project management, budgeting, and scheduling. Ability to conduct fabrication data analysis through scripting in MATLAB or Python is a plus. Experiences with automation on fabrication data collection is a plus. Knowledge of semiconductor reliability requirements and compliance with standards such as JEDEC is desirable. Garmin International is an equal opportunity employer. Qualified applicants will receive consideration for employment without regard to race, religion, color, national origin, citizenship, sex, sexual orientation, gender identity, veteran’s status, age or disability. This position is eligible for Garmin's benefit program. Details can be found here : Garmin BenefitsEssential Functions Serves as a project lead in a clean room environment, responsible for process development, process integration and device fabrication Responsible for defining specifications, establishing qualification and acceptance criteria, and managing project budgets and timelines Strong track record of process development, process optimization, design of experiments methodology, statistical data analysis and problem solving Ability to combine disparate process recipes into a full fabrication flow and understand the impact of process interdependence Possesses experience and process development expertise in contact / stepper photolithography, wet and plasma dry etches, high aspect-ratio deep reactive ion etching (DRIE) of silicon, glass and other relevant materials, chemical vapor deposition, dielectric and metal depositions, wafer bonding and vacuum encapsulation of microscale structures, sacrificial and structural layer creation and wet / dry release Ability to conduct metrology such as optical / infrared microscope inspections, interferometric measurements and scanning electron microscopy with elemental analysis is required. Collaborates closely with cross-functional teams including electrical engineers, mechanical engineers, and manufacturing teams Offers process improvement suggestions, authors new procedures, and provides technical input to product development plans and concept documents along with making substantial contributions toward determination of project goal / objective feasibility Demonstrated strong documentation skills in fabrication process development and experimental work Ability to modify and / or review mask layouts in CAD layout software such as Klayout

Basic Qualifications Bachelor’s Degree in Electrical Engineering, Computer Engineering, Software Engineering or related field AND a minimum of 1 year relevant experience OR an equivalent combination of education and experience Excellent academics (cumulative GPA greater than or equal to 3.0 as a general rule) Demonstrated ability with application of design standards and procedures to design and develop moderately complex analog, digital and / or RF designs including simulations, schematics, PCB layouts and evaluation Demonstrated ability with electrical engineering tools Demonstrated knowledge of design impacts on manufacturability Desired Qualifications Back-end wafer process experience in wafer grinding, CMP, die singulation and assembly processes into packages is a plus. Experiences with project management, budgeting, and scheduling. Ability to conduct fabrication data analysis through scripting in MATLAB or Python is a plus. Experiences with automation on fabrication data collection is a plus. Knowledge of semiconductor reliability requirements and compliance with standards such as JEDEC is desirable. Garmin International is an equal opportunity employer. Qualified applicants will receive consideration for employment without regard to race, religion, color, national origin, citizenship, sex, sexual orientation, gender identity, veteran’s status, age or disability. This position is eligible for Garmin's benefit program. Details can be found here : Garmin Benefits