Job Details : Job Description :
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by :
The ideal candidate will demonstrate :
This position requires regular onsite presence.
Qualifications :
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and / or internship experiences.
Minimum Qualifications :
Preferred Qualifications :
One or more years of experience in any of the following :
Job Type : College Grad
Shift :
Shift 1 (United States of America)
Primary Location : US, Arizona, Phoenix
Additional Locations :
Business group :
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly / test packages the compute devices to improve the lives of every person on Earth.
Posting Statement :
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N / A
Benefits :
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here :
https : / / intel.wd1.myworkdayjobs.com / External / page / 1025c144664a100150b4b1665c750003
Annual Salary Range for jobs which could be performed in the US : $133,800.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence.
Packaging Engineer • Phoenix, AZ, United States