Process Engineer, Texas Institute for Electronics

Job Details

General Notes

This position may be filled at a higher-level title, relative to experience and qualifications of the selected candidate. Relocation assistance may be available.

About Us

The is a rapidly growing public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Our mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. We are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc. We are seeking a number of motivated individuals to join our team and help us achieve our mission.

TIE is one of the fastest growing research centers at the University of Texas at Austin and part of the , a global leader in technology innovation and engineering education for over a century. With 11 undergraduate and 13 graduate programs, over 20 research centers and a faculty community that boasts one of the highest number of National Academy of Engineering members among U.S. universities, Texas Engineering has launched some of the nation’s most accomplished leaders and pioneered world-changing solutions in virtually every industry, from space exploration to energy to health care. Situated in the heart of Austin — named “America’s Coolest City” by Expedia and “The Best Place to Live in the U.S.” by U.S. News and World Report — the Cockrell School embodies the city’s innovative spirit.

UT Austin, recognized by Forbes as one of , provides outstanding and packages that include :

Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)

Voluntary Vision, Dental, Life, and Disability insurance options

Generous paid vacation, sick time, and holidays

Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds

Additional Voluntary Retirement Programs : Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)

Flexible spending account options for medical and childcare expenses

Robust free training access through LinkedIn Learning plus professional conference opportunities

Tuition assistance

Expansive employee discount program including athletic tickets

Free access to UT Austin's libraries and museums with staff ID card

Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card

For more details, please see : and

Purpose

The Process Engineer develops and executes semiconductor fabrication process flows for advanced 3D HI applications using a wide variety of internal and external fabrication resources.

Responsibilities

• Running, developing and integrating semiconductor fabrication processes across a wide variety of semiconductor equipment. This would include running experiments, performing detailed process characterization, performing data analysis, documentation of processes of record, presentation of results, and incorporating feedback from engineers / techs.
• Developing processes-of-record and implementing these on product samples for customers.
• Assisting with documents such as proposals or reports on costs and inventory levels.

Required Qualifications

Process Engineer I :

High School Diploma or GED and at least ten years of experience in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines, or,

Bachelor's degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and at least six years of relevant experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.

Process Engineer II :

Bachelor's degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and eight years of relevant experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection, or,

Master's degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and six years of relevant experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.

Senior Process Engineer :

Bachelor’s degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and ten years of experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection, or

Master's degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and eight years of relevant experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.

For all levels :

Preferred Qualifications

Process Engineer I :

Three years of experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.

Process Engineer II :

Master's degree or higher. Five or more years of relevant experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.

Senior Process Engineer :

Master's degree or higher. Ten or more years of experience in nanofabrication and exposure to wafer processing and characterization in cleanrooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.

For all levels :

Salary Range

Working Conditions

Required Materials

Important   for applicants who are NOT current university employees or contingent workers :  You will be prompted to submit your resume the first time you apply, then you will be provided an option to upload a new Resume for subsequent applications. Any additional Required Materials (letter of interest, references, etc.) will be uploaded in the Application Questions section; you will be able to multi-select additional files. Before submitting your online job application, ensure that ALL Required Materials have been uploaded. Once your job application has been submitted, you cannot make changes.

Important for Current university employees and contingent workers :  As a current university employee or contingent worker, you MUST apply within Workday by searching for Find UT Jobs. If you are a current University employee, log-in to Workday, navigate to your Worker Profile, click the Career link in the left hand navigation menu and then update the sections in your Professional Profile before you apply. This information will be pulled in to your application. The application is one page and you will be prompted to upload your resume. In addition, you must respond to the application questions presented to upload any additional Required Materials (letter of interest, references, etc.) that were noted above.

Employment Eligibility :

Regular staff who have been employed in their current position for the last six continuous months are eligible for openings being recruited for through University-Wide or Open Recruiting, to include both promotional opportunities and lateral transfers. Staff who are promotion / transfer eligible may apply for positions without supervisor approval.

Retirement Plan Eligibility :

The retirement plan for this position is Teacher Retirement System of Texas (TRS), subject to the position being at least 20 hours per week and at least 135 days in length. This position may have the option to elect the Optional Retirement Program (ORP) instead of TRS, dependent upon the job profile you qualify for, and subject to the position being 40 hours per week and at least 135 days in length.

Background Checks :

A criminal history background check will be required for finalist(s) under consideration for this position.