Substrate Design Engineer

A company is looking for a Substrate Design Engineer to join a cutting-edge semiconductor team in a hybrid / remote role.

Key Responsibilities

Lead the physical layout of complex multi-die substrates supporting chiplet-based integration

Collaborate with package integration, signal / power integrity, and mechanical teams for successful layout implementation

Drive routing feasibility and co-design alignment with floor planning, mechanical, and system constraints

Required Qualifications

8+ years of experience in substrate layout design for advanced packaging

Must be eligible to work in the United States and maintain an Active U.S. Government Secret Clearance

Strong background in physical layout and collaboration with ASIC, signal, and power teams

Experience with packaging technologies such as CoWoS, FPGA, CPU, GPU, and / or MCM

Bachelor's degree in Electrical Engineering preferred