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​​Advanced Semiconductor Packaging Engineer​
​​Advanced Semiconductor Packaging Engineer​The Aerospace Corporation • El Segundo
​​Advanced Semiconductor Packaging Engineer​

​​Advanced Semiconductor Packaging Engineer​

The Aerospace Corporation • El Segundo
[job_card.30_days_ago]
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  • [job_card.full_time]
[job_card.job_description]

The Aerospace Corporation is the trusted partner to the nation’s space programs, solving the hardest problems and providing unmatched technical expertise. As the operator of a federally funded research and development center (FFRDC), we are broadly engaged across all aspects of space— delivering innovative solutions that span satellite, launch, ground, and cyber systems for defense, civil and commercial customers. When you join our team, you’ll be part of a special collection of problem solvers, thought leaders, and innovators. Join us and take your place in space.

At the Mission Payloads Division (MPD), we are pioneers in remote sensing systems that guide our country’s space enterprise. Our talented and dynamic people create and flourish in electronics, sensors, radar, artificial intelligence (AI), and advanced data network domains. We boldly advance technology through our research and development and then forward to demonstration and integration. With innovative laboratories and prototyping, MPD delivers groundbreaking results. We guide our Department of Defense, intelligence community, and civil clients to enhance national productivity and security and tackle the most critical missions. Bring your intelligence and creative spirit and join us at MPD!

The Parts, Materials & Processes Department (PMPD) includes subject matter experts across a broad range of areas pertaining to electrical, electronic, and electromechanical (EEE) parts procurement, qualification, application, root cause failure analysis, as well as materials and processes. Our expertise combined with a sophisticated in-house electronic component laboratory deliver innovative analysis and PM&P program management capabilities to national space systems and civil customers.

PMPD is seeking an Advanced Semiconductor PackagingEngineer (Engineering Specialist - Microelectronics / Semiconductor Engineering) with proficiency in packaging, assembly, and testing, related procurement standards, related control boards for program management and adjudication of nonconformities.

Work Model: The selected candidate will be required to work full time on-site at our facility at either El Segundo, CA or Chantilly, VA .

What You’ll Be Doing

  • Provide ongoing technical consultation and advice to management, internal/external customers, and contractors on the evaluation, selection, and use of advanced semiconductor packaging (e.g., 2.5/3D,system in package, multi-chip module) for space and missile applications

  • May lead cross-organizational teams and organize interfaces within department

  • Collaborate with industry colleagues, and component supplier personnel to create/maintain guidance and requirements related to selection, screening, qualification, and root cause failure analysis

  • Act as organization’s designated representative at technical meetings, presentation, and workshops

  • Mentor less experienced staff – as required – and serve as role model

What You Need to be Successful - Engineering Specialist

Minimum Requirements:

  • Bachelor’s degree from an accredited university in materials science, electrical engineering, physics, or another appropriate discipline

  • At least eight years of increasingly responsible and related engineering/scientific experience (time spent obtaining advanced degree counts towards this).

  • Proficiency in industry PMP requirements standards development for advancedsemiconductor packaging – including related, componentselection, assembly materials, and processes (PMP), and selection of elements

  • Experience supporting parts, materials, and processes (PM&P) program management functions which include -- control boards, design reviews, and manufacturing readiness reviews

  • Excellent record of customer communication and interaction

  • Willingness to travel [domestically/internationally] approx. 25% of time

  • This position requires ability to obtain and maintain a TS/SSBI security clearance, which is issued by the US government. U.S citizenship is required to obtain a security clearance.

How You Can Stand Out

It would be impressive if you have one or more of these:

  • Advanced degree from an accredited university in materials science, electrical engineering, physics, or another appropriate discipline

  • 8+ years of experience in advanced semiconductor packaging (time spent obtaining advanced degree counts towards this).

  • Experience leading/managing teams to evaluate, select, and qualify electronic parts, materials, and processes (PMP) for space-related applications while balancing risks

  • Demonstrated ability to assess non-MIL PRF parts and develop appropriate methods for use in space and related high-reliability applications

  • Hold an active TS/SSBI security clearance

  • Proficiency in common root cause analysis tools during problem resolution

  • Experience collaborating with contractors, industry working groups, and/or associations such as NASA Electronics Parts Assurance Group, Defense Logistics Agency, Joint Electron Device Engineering Council, Automotive Electronics Council, during the evaluation, selection, and adaptation of active electronic parts for space-related applications]

  • Possess project management skills in applications such as MS Project, Jira, etc.

We offer a competitive compensation package where you’ll be rewarded based on your performance and recognized for the value you bring to our business. The grade-based pay range for this job is listed below. Individual salaries within that range are determined through a wide variety of factors including but not limited to education, experience, knowledge and skills.

(Min - Max)

$117,300 - $175,900Pay Basis: Annual

Leadership Competencies

Our leadership philosophy is simple: every employee, regardless of level and role, can demonstrate leadership. At Aerospace, our commitment is our people. To cultivate our talent and ensure that we have a strong pipeline of future leaders, we want individuals who:

  • Operate Strategically
  • Lead Change
  • Engage with Impact
  • Foster Innovation
  • Deliver Results

Ways We Reward Our Employees

During your interview process, our team will provide details of our industry-leading benefits.

Benefits vary and are applicable based on Job Type. A few highlights include:

  • Comprehensive health care and wellness plans

  • Paid holidays, sick time, and vacation

  • Standard and alternate work schedules, including telework options

  • 401(k) Plan — Employees receive a total company-paid benefit of 8%, 10%, or 12% of eligible compensation based on years of service and matching contributions; employees are immediately eligible and vested in the plan upon hire

  • Flexible spending accounts

  • Variable pay program for exceptional contributions

  • Relocation assistance

  • Professional growth and development programs to help advance your career

  • Education assistance programs

  • An inclusive work environment built on teamwork, flexibility, and respect

We are all unique, from various backgrounds and all walks of life, yet one thing bonds all of us to each other—the belief that we can make a difference. This core belief empowers us to do our best work at The Aerospace Corporation.

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Advanced Semiconductor Packaging Engineer • El Segundo

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