About Eridu

Eridu is a Silicon Valley-based hardware startup pioneering infrastructure solutions that accelerate AI data centers to deliver Faster AI. Today’s AI performance is frequently limited by communication bottlenecks. Eridu introduces multiple industry-first innovations across silicon, packaging, software, and systems to deliver an order of magnitude improvement in performance and unlock greater GPU utilization to speed training job completion times and tokens-per-second for more profitable inference. We do this while simultaneously reducing capital and power costs and improving reliability.

The company’s solutions and value proposition have been widely validated by leading hyperscalers.

Eridu has raised over $200M to date including its most recent, oversubscribed Series A round. The company is led by a veteran team of Silicon Valley executives who have delivered multiple billion dollar product lines and led multiple companies to billion dollar exits, including serial entrepreneur Drew Perkins, co-founder of Infinera (NASDAQ: INFN), Lightera (acq. by Ciena), Gainspeed (acq. by Nokia) and Mojo Vision (the world’s leading micro-LED company). The company is in execution mode and has a world-class engineering team with decades of experience in state-of-the-art silicon, packaging, optics, software, and systems. Eridu is working with best-in-class supply chain partners including silicon, packaging and systems.

Visit our website eridu.ai to learn more.

Position Overview

We are seeking an innovative and experienced Senior Mechanical Engineer to lead the design, integration, and validation of mechanical systems and advanced packaging for high-performance computing and communication hardware. This role requires a strong foundation in mechanical design, DFM, and system-level integration, as well as the ability to drive innovation in liquid cooling, IC packaging, and manufacturing processes.

Responsibilities

• Mechanical Design: Design and optimize chassis, enclosures, cold plates, and mounting structures for rack-mounted systems, ensuring performance, structural integrity, thermal efficiency, and manufacturability.
• Material Selection: Select materials based on thermal, mechanical, and electrical properties to meet reliability and performance goals.
• Prototyping & Testing: Build and test mechanical and packaging prototypes. Conduct validation testing (thermal cycling, shock, vibration) and iterate on design improvements.
• Cross-Functional Collaboration: Partner with electrical, thermal, and manufacturing engineers to integrate electrical/optical components into product designs and ensure functional compatibility.
• Design for Manufacturing & Root Cause Analysis: Apply DFM principles early in the design cycle. Lead FMEA, conduct root cause investigations, and resolve reliability and yield challenges.
• Documentation & Communication: Develop comprehensive documentation, including specifications, test plans, design reports, and manufacturing drawings. Present designs and findings to technical and non-technical stakeholders.
• Quality Assurance: Ensure compliance with industry standards and implement QA processes throughout the design and development lifecycle.

Minimum Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, or a related field
• 5+ years of experience in mechanical and packaging design, with a proven track record of bringing products from concept to high-volume production
• Strong knowledge of mechanical design for electronics systems, including chassis, board-level components, and packaging for high-speed electrical and optical interconnects
• Expertise in Design for Manufacturability (DFM), Failure Mode and Effects Analysis (FMEA), and root cause analysis methodologies
• Proficiency in 3D CAD tools such as SolidWorks, Creo, or AutoCAD
• Strong written and verbal communication skills, with the ability to clearly document technical concepts and collaborate across cross-functional teams

Preferred Qualifications

• 10+ years of experience in mechanical design and packaging for computing or communication hardware systems
• Familiarity with photonics integration, and substrate-level mechanical design.
• Experience collaborating with ODMs, OSATs, and contract manufacturers to define manufacturing processes and solve DFM challenges
• Demonstrated innovation in mechanical architecture, system packaging, or high-density electronics integration
• Experience with advanced thermal solutions including cold plates, manifolds, and CDUs for liquid cooling is a plus
• Experience in simulation tools such as Ansys Mechanical, Icepak, or Flotherm is a plus
• Experience with quality and statistical analysis tools such as JMP is a plus

Why Join Us?

At Eridu, you’ll have the opportunity to shape the future of AI infrastructure, working with a world-class team on groundbreaking technology that pushes the boundaries of AI performance. Your contributions will directly impact the next generation of AI infrastructure solutions, transforming the performance of AI data centers.

The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles.

Notice to Recruiting Agencies

Eridu does not accept unsolicited resumes or candidate profiles from staffing agencies or third-party recruiters. Any candidate submitted to Eridu without prior written authorization from our recruiting team will be considered unsolicited and will become the property of Eridu. Eridu reserves the right to pursue and hire such candidates without any obligation to pay fees. Recruiting agencies are expressly instructed not to contact hiring managers, employees, or executives regarding open positions.

The pay range for this role is:
210,000 - 265,000 USD per year(San Francisco Bay Area)

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