Technical Program Manager - Electronic Packaging

Job/Position Summary

3DGS is seeking a highly motivated Technical Program Manager (TMP) to lead complex, cross-functional programs in the advanced electronics packaging space. This role requires a strong technical background, exceptional project management skills, and the ability to work collaboratively across internal teams and with external customers. This position will oversee the full lifecycle of electronic packaging projects, including customer engagement, electronic design coordination, fabrication, assembly, and testing. Success in this role requires proactive risk management, tight schedule control, and strong communication to ensure alignment across multiple stakeholders and delivery of programmatic milestones on time and within scope.

Primary Responsibilities

• Program Ownership: Lead end-to-end execution of technical programs from customer kick-off through design, fabrication, assembly, test, and delivery.
• Customer Engagement: Act as the primary interface for customers on program status, milestones, and technical coordination. Translate customer requirements into actionable internal tasks.
• Cross-Company Coordination: Collaborate with engineering, manufacturing, supply chain, quality, and external vendors to ensure alignment of schedule and deliverables.
• Schedule & Deliverable Management: Develop, maintain, and drive integrated program schedules. Monitor progress and escalate issues as needed to maintain momentum.
• Risk Management: Identify program risks early, develop mitigation plans, and drive resolution of technical and logistical challenges.
• Technical Leadership: Work closely with engineering teams to ensure that designs are feasible, manufacturable, and aligned with customer expectations.
• Status Reporting: Deliver regular updates to internal stakeholders and customers on program health, risks, and completion metrics.
• Process Improvement: Contribute to the continuous improvement of program management processes and tools.

Requirements

• Bachelors degree in Engineering (Electrical, Mechanical, Materials Science, or related field); Masters degree preferred.
• 5+ years of experience in technical program management or engineering leadership roles, ideally in electronics packaging, semiconductor, or hardware development.
• PMP or similar project management certification preferred.
• Experience working with defense, aerospace, or medical device customers (including navigating compliance and documentation requirements) preferred.
• This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship due to government contracts.
  

Knowledge, Skills, and Abilities

• Deep understanding of the product lifecycle in advanced electronics packaging, including design, fabrication, assembly, and test.
• Proven experience managing cross-functional teams in a fast-paced, highly technical environment.
• Strong communication and interpersonal skills; ability to work directly with customers and internal executives.
• Expertise in project management tools (e.g., MS Project, Smartsheet, Jira) and methodologies.
• Demonstrated ability to manage schedules, drive accountability, and deliver results under tight deadlines.
• Experience working in or with a high-mix, low-volume manufacturing environment preferred.
• Familiarity with advanced packaging technologies (e.g., 2.5D/3D integration, chiplets, substrate design) preferred.

Physical/Working Requirements

• Must be able to wear personal protective gear most of the day (where applicable).
• Prolonged periods of sitting or standing.

Behavioral Traits

• Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
• A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
• The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives and engaging all levels of the organization.

Why Join Us?

• Work on cutting-edge technology in the rapidly evolving field of advanced packaging and RF electronics.
• Collaborate with industry-leading experts to solve complex thermal challenges for next-generation products.
• Be part of a dynamic, innovative startup environment, offering significant opportunities for professional growth and career development.
  
• Opportunity to make a direct impact on high-performance systems used in industries like telecommunications, defense, and computing.