Package Design EngineerGoldenpick Technologies • San Jose, California, USA
Package Design Engineer
Goldenpick Technologies • San Jose, California, USA
[job_card.variable_days_ago]
[job_preview.job_type]
- [job_card.full_time]
[job_card.job_description]
Requirements / Skills :
- Possess Mentor Graphics Cadence PLA knowledge
- Multiple layers package design (8) experience
- Understanding of substrate manufacturing design rule and assembly rule
- Possess Flip Chip Package Design Concept
- Good communication skill.
- May require vendor on-site support
Key Skills
Load & Unload,Ruby,Shipping & Receiving,Forklift,Lift Truck Experience,Basic Math,Packaging,Warehouse Experience,Delivery Driver Experience,Heavy Lifting,Human Resources,RF Scanner
Employment Type : Full Time
Experience : years
Vacancy : 1
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Design Engineer • San Jose, California, USA
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