Packaging Module Development Engineer

Job Details : Job Description :

Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision.

Join us and build on our legacy of innovation and collaboration as we deliver world-changing technology that improves the life of every person on the planet.

We are looking for someone who is : Passionate about learning new technical skills in software development and test technology. Passionate about helping colleagues and partners to deliver higher-quality software. Excited to work collaboratively on a scrum team Able to work asynchronously as part of a global team. Excited to enable Intel IT to deliver amazing quality and value to our customers while helping IT teams do great work and have fun.

The primary responsibilities for this role will include, but are not limited to :

Develops assembly processes and / or equipment and apply novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.

Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces. Ensures manufacturability of physical layout of package design and oversee the cycle of manufactured package processes, procedures and flows.

Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.

Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability. Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.

Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods. Provides consultation concerning packaging problems and improvements in the packaging process and responds to customer / client requests or events as they occur.

Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process / technology maturity for products towards key risk areas in meeting product milestones.

Qualifications :

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork / classes / research.

Minimum Qualification :

Education : Master's (6+ months) or PhD (1+ yr) of experience

Relevant experience must include the following :

• Optics fundamentals as applied to imaging techniques (light sources, resolutions, algorithm applications), light-matter interaction.

Preferred Qualifications :

Masters (6+ months) or PhD (1+ yr) of experience in one or more of the following :

Semiconductor Inspection (wafer, package, etc.).

Fundamental physical processes, troubleshoot complex ultra-high precision equipment across a variety of disciplines including optical, laser, motion or electrical systems.

Statistical principles, process control (SPC) and Design of Experiments (DOE).

Fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.

Semiconductor devices and packing technology.

Data science and statistics tools (Python is highly preferred). Data management and visualization experience.

Dimensional management for package features and planes.

Machine Vision techniques, OpenCV experience and CNN Image Classification.

Interview Tips here. (https : / / www.intel.com / content / www / us / en / jobs / hiring.html)

By applying to this posting your resume and profile will become visible to Intel Recruiters and will allow them to consider you for current and future job openings aligned with the skills and positions mentioned above.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here (https : / / jobs.intel.com / en / benefits) .

o Intel Benefits : https : / / www.intel.com / content / www / us / en / jobs / benefits.html

o Life Inside Intel : https : / / www.intel.com / content / www / us / en / jobs / life-at-intel.html

o Interviewing Tips : https : / / www.intel.com / content / www / us / en / jobs / hiring.html

Intel's core values : https : / / www.intel.com / content / www / us / en / corporate-responsibility / our-values.html?wapkw=our%20company

Job Type : College Grad

Shift :

Shift 1 (United States of America)

Primary Location : US, Arizona, Phoenix

Additional Locations :

Business group :

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly / test packages the compute devices to improve the lives of every person on Earth.

Posting Statement :

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N / A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel (https : / / intel.wd1.myworkdayjobs.com / External / page / 1025c144664a100150b4b1665c750003) .

Annual Salary Range for jobs which could be performed in the US : $133,800.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence.