Job Title : Lead Photonics Packaging Engineer
Location : Bay Area or Austin, TX
Compensation : $150K - $300K DOE plus equity
Requirement : Photonics Packaging, Silicon Photonics Integration, Optical Modules, Assembly Processes
Position Overview
We are seeking a highly skilled Lead Photonics Packaging Engineer to join our innovative team. The ideal candidate will be responsible for leading packaging development for silicon photonics and optical modules, driving the integration of photonics technologies into advanced packaging solutions.
Key Responsibilities
- Lead the design and development of packaging solutions for silicon photonics and optical modules.
- Oversee the integration of photonics components into semiconductor packaging processes.
- Collaborate with cross-functional teams to ensure seamless integration of packaging and photonics technologies.
- Develop and implement wafer-level packaging and integration strategies.
- Conduct failure analysis and reliability testing to ensure high-quality packaging solutions.
- Mentor and guide junior engineers in packaging design and manufacturing processes.
Qualifications
Bachelor's or Master's degree in Electrical Engineering, Materials Science, or related field.Minimum 5 years of experience in photonics packaging or semiconductor packaging.Strong knowledge of silicon photonics, packaging techniques, and optical module design.Experience with flip-chip and wafer-level packaging technologies.Familiarity with photonics integration and related manufacturing processes.Experience leading and managing teams is preferred.Excellent problem-solving skills and ability to work collaboratively in a team environment.Medical, dental, and vision benefitsEmployee Stock OptionsPTO / Vacation401KA pivotal role in an innovative startup redefining the future of AI hardware!Opportunities for career growth and future team leadershipAccess to cutting-edge technology and state-of-the-art facilities#J-18808-Ljbffr