Semiconductor Packaging Engineer

We are seeking two talented and motivated wafer fab process engineers with a focus on advanced semiconductor packaging to join our cutting-edge fabrication team. In this role, you’ll work on the forefront of 3D chip stacking and flip-chip hybridization, building integrated devices that form the heart of next-generation electronic systems.This is your opportunity to work hands-on with state-of-the-art hybridization equipment, contributing directly to breakthrough innovations in device performance and packaging efficiency.Location: Shoreview, MN Wage: $70,000 - $85,000/year, depending on experienceHours: 1st shift | Monday – Friday | 7:30 am – 3:30 pmBenefits of the semiconductor advanced packaging engineer:

Be part of a dynamic and innovative engineering team

Opportunity to grow into a technical leadership role

Work directly on advanced optical semiconductor technologies

Career development in a forward-thinking environment

Health, dental, vision, life, and disability insurance

401(k)

Scheduled raise/salary review

Company parties

Stable shop with long term customers

Duties of the semiconductor advanced packaging engineer:

Operate chip stacking and hybridization equipment (FC-150, FC-300) for flip-chip 3D processes

Run and support fab tools like evaporation, sputtering, or RIE as needed

Perform process QC to maintain high yield and product quality

Document, troubleshoot, and improve processes

Work with engineering teams to scale operations and build future team capability

Requirements of the semiconductor advanced packaging engineer:

Bachelor’s or Master’s in Physics or Engineering (required)

Interest in advanced packaging and hybridization

Experience with deposition or etch equipment (preferred)

Flip-chip or 3D packaging experience a plus

Additional information:Apply today! To learn more about this semiconductor advanced packaging engineer position, contact Matt at 763-571-7077.EOE: Twin City Staffing is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or veteran status.{"@context":"","@type":"JobPosting","baseSalary":null,"datePosted":"2026-02-19","validThrough":"2027-02-19","description":"

• Be part of a dynamic and innovative engineering team
• Opportunity to grow into a technical leadership role
• Work directly on advanced optical semiconductor technologies
• Career development in a forward-thinking environment
• Health, dental, vision, life, and disability insurance
• 401(k)
• Scheduled raise/salary review
• Company parties
• Stable shop with long term customers

• Operate chip stacking and hybridization equipment (FC-150, FC-300) for flip-chip 3D processes
• Run and support fab tools like evaporation, sputtering, or RIE as needed
• Perform process QC to maintain high yield and product quality
• Document, troubleshoot, and improve processes
• Work with engineering teams to scale operations and build future team capability

• Bachelor’s or Master’s in Physics or Engineering (required)
• Interest in advanced packaging and hybridization
• Experience with deposition or etch equipment (preferred)
• Flip-chip or 3D packaging experience a plus

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