Silicon Design Package Designer

At Tech Mahindra ( Tech Mahindra | Connected World, Connected Experiences ), we live the philosophy of connected world and connected experiences. We thrive on change that is powered by the intelligent symphony of technology and humans designing meaningful and sustainable experiences. Consumer ‘experiences’ are driving and disrupting industries like never before. Businesses must build seamless yet simple enterprises that collaborate, synergize, and drive the change. Change that connects us all and empowers us to deliver experiences that span across the digital, the physical, the convergent, and everything in between. That’s when truly connected experiences manifest.

Extraordinary is when experiences come together – a continuous convergence of digital technologies, touchpoints, and most importantly people. It’s time to reimagine, reinvent, and revolutionize business models & operations as well as to transform enterprises into living, breathing, and connected businesses. We are the Digital Change makers who strive to change the way the world, communities, businesses, and humans interact digitally. We are harnessing the power of change, brought in by technologies, that makes it the most exciting time to be alive in the human history. Our universe, as we build it, disrupt it, and redesign it, is powering the digital change. Tech Mahindra represents the connected world, offering innovative and customer-centric information technology experiences, enabling Enterprises, Associates, and the Society to Rise. It has 150,000+ professionals working for 1000+ Global Customers (including Fortune 500 companies) in 90 Countries. We’re part of the esteemed Mahindra group, headquartered in India. Under a new CEO, Tech Mahindra is committed to a transformative journey with 'Scale @ Speed' as our guiding principle.

We're looking to hire a Silicon Design Package Designer who would posses working experience with the following t ools :

• Mentor / Siemens and Cadence tools (especially for Package Layout Automation - PLA).
• Technical Expertise : Multi-layer package design experience.
• Understanding of substrate manufacturing Design Rules and Assembly Rules .
• Familiarity with SIPI (Signal Integrity & Power Integrity) Rules .
• Flip-chip package design concepts.

An ideal hire would manage the following responsibilities & bring these skills :

The pay range for this role is $140,000- $145,000 per annum including any bonuses or variable pay. Tech Mahindra also offers benefits like medical, vision, dental, life, disability insurance and paid time off (including holidays, parental leave, and sick leave, as required by law). Ask our recruiters for more details on our Benefits package. The exact offer terms will depend on the skill level, educational qualifications, experience and location of the candidate.

Tech Mahindra is an Equal Employment Opportunity employer. We promote and support a diverse workforce at all levels of the company. All qualified applicants will receive consideration for employment without regard to race, religion, color, sex, age, national origin, or disability. All applicants will be evaluated solely on the basis of their ability, competence, and performance of the essential functions of their positions with or without reasonable accommodations. Reasonable accommodations also are available in the hiring process for applicants with disabilities. Candidates can request a reasonable accommodation by contacting the company ADA Coordinator at ADA_Accomodations@TechMahindra.com .