Sensor operator • lowell ma
NASDAQ: ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge.ADI combines analog, digital, and software technologies into ...Show more
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NASDAQ: ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge.ADI combines analog, digital, and software technologies into ...Show more
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The average salary range is between $ 43,680 and $ 125,550 year , with the average salary hovering around $ 91,953 year .
About Analog Devices
Analog Devices, Inc. (NASDAQ: ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible™. Learn more at and on and.
Analog Devices Inc., Chelmsford Massachusetts facility is looking for a Wirebond Operator to support our continued growth in the manufacture of high-performance microwave modules and sub-systems. Customers trust Analog Devices to deliver integrated electronics, and ADI is interested in energetic and organized team players that want to deliver quality products in a high-tech manufacturing environment.
This is a hands-on position that requires a strong ability to work on delicate parts utilizing a microscope.
Responsibilities:
Automated and manual wedge and ball bonding (F&K, Hesse, manual bonders)
Bond pull/shear testing and rework (Dage testers)
Die shear/stud pull testing
Plasma and solvent cleaning technologies
Ability to work 8 hours under the microscope utilizing miniaturized hand tools such as tweezers and fine screwdrivers.
In-process inspection and self-inspection.
Good computer skills are required to support retrieval of drawings and work instructions, as well as other job activities.
Ability to read and work from detailed process sheets, prints and drawings.
Ability to follow both written and verbal instructions.
Hand assembly using a variety of tools and or equipment according to specifications/process
Handle of ESD sensitive material and equipment
Willing to be cross-trained and perform other related duties as required.
Demonstrate a keen awareness of safety practices and familiarity with OSHA standards.
REQUIREMENTS:
US Citizenship and able/willing to obtain a government security clearance.
High school diploma/GED required. A diploma from a Vocational High School or Technical Diploma is a plus.
2-3 Years of RF/DC gold wire and ribbon bonding using manual, semi-manual, semi-automatic & automatic equipment experience, familiarity with microelectronics assembly processes
Ability to follow both verbal and written instructions/documentation.
Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.
