Technician 3, Production

Location: Alhambra, CA (Onsite)

Position Summary: The Senior InP Wafer Fab Technician is responsible for executing and maintaining wafer fabrication processes for InP-based photonic devices, including DFB lasers and gain chips. This role requires extensive hands-on experience in III-V semiconductor processing, particularly holographic grating fabrication, metallization, and etching processes for InP materials. The technician will support multiple fabrication modules within the wafer fabrication line and play a key role in maintaining stable process operation, repeatability, and manufacturing yield. This position requires strong technical expertise, problem-solving capability, and the ability to work independently in a compound semiconductor cleanroom environment.

Responsibilities:

DFB Grating Fabrication and Characterization (35%):

• Perform grating fabrication for DFB laser structures using holographic lithography methods.
• Set up and align holographic exposure systems to generate precise grating patterns.
• Characterize grating pitch, depth, and uniformity using Atomic Force Microscopy (AFM).
• Analyze grating profile data and ensure process consistency and repeatability.
• Maintain and calibrate holographic exposure and AFM metrology systems.
• Troubleshoot grating-related defects and process variations.

Metallization Process (20%):

• Operate metal deposition tools including e-beam evaporation systems.
• Execute metal stack deposition for p-contacts, n-contacts, and device interconnects.
• Perform metal lift-off processes and inspect pattern quality.
• Monitor film thickness and deposition uniformity.
• Maintain process documentation and support troubleshooting of metallization-related issues.

Wet and Dry Etch Processing (20%):

• Perform wet chemical etching for InP and related III-V semiconductor materials.
• Operate dry etch systems such as RIE or ICP tools for pattern transfer and device definition.
• Monitor etch rates, profiles, and uniformity.
• Maintain chemical safety procedures and proper handling of process gases and chemicals.
• Support optimization and troubleshooting of etch processes.

Photolithography Process and SEM Support (15%):

• Support photolithography processes including resist coating, exposure, and development.
• Assist in mask alignment and lithography process setup for device fabrication.
• Operate Scanning Electron Microscopy (SEM) for pattern inspection, feature verification, and process qualification.
• Perform basic inspection and process monitoring to ensure pattern quality.
• Work closely with process engineers to maintain stable lithography operations.

Process Module Ownership and Fab Support (10%):

• Own and manage assigned process modules within the wafer fabrication line.
• Monitor tool performance, uptime, and process stability.
• Assist with preventive maintenance and troubleshooting equipment.
• Maintain process documentation and support continuous improvement initiatives.

Minimum Qualifications:

• Associate’s degree preferred.
• Minimum 10 years of hands-on experience in InP wafer fabrication processing.
• Direct experience with DFB laser and gain chip wafer fabrication in a compound semiconductor manufacturing environment.
• Strong expertise in InP-based III-V semiconductor fabrication processes.
• Hands-on experience with DFB grating fabrication using holographic lithography techniques.
• Proficiency in Atomic Force Microscopy (AFM) for grating and surface characterization.
• Experience with e-beam evaporation and metallization lift-off processes.
• Strong knowledge of wet chemical etching and plasma dry etching of InP materials.
• Ability to manage and operate multiple wafer fab process modules.
• Strong troubleshooting and problem-solving skills in a cleanroom environment.
• Familiarity with semiconductor manufacturing documentation, safety practices, and process control.

A reasonable estimate of the pay range for this position is $27 - $39/hr. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.

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