Acquired by Amazon in 2015, Annapurna Labs has grown from a stealth chip-design startup into the silicon engine behind AWS's most advanced AI infrastructure, designing custom silicon and software including AWS Trainium, Inferentia, Graviton, and Nitro. This is a rare opportunity to join that mission at the hardware foundation level, shaping the PCB technologies that carry next-generation AI accelerator chips from concept to global Data Center deployment, in a space where the playbook is still being written.
This role partners with leading PCB fabricators and material suppliers to pioneer next-generation technologies powering AI inference and training hardware, define development roadmaps, and qualify new processes and materials for reliable mass production. Working closely with Design Engineering and Signal Integrity teams, you will own the end-to-end PCB and PCBA technology roadmap across Annapurna's ML product line, building the strategy from the ground up, from early-stage R&D through mass-production readiness, while getting ahead of PCB, PCBA, and SMT requirements critical to large-scale AI accelerator platforms.
You will lead the strategic sourcing, quality, delivery, and commercial management of a global PCB supply base that doesn't fully exist yet, identifying, qualifying, and building supplier relationships capable of scaling with the explosive growth of AI infrastructure. This means selecting and pre-qualifying partners, securing capacity, and allocating market share across NPI and mass-production demands. Beyond supply, you will architect technical programs that advance PCB and PCBA technologies short- and long-term, drive R&D for next-generation materials, interconnect structures, and assembly processes, and set the standard for yield, reliability, and cycle time across all NPI quick-turn builds.
BASIC QUALIFICATIONS
- B.S. or higher in Materials Science, Chemistry, Electrical Engineering, or related technical discipline or equivalent experience.
- 10+ overall years of experience across PCB and PCBA/SMT technologies, including at least 5 years leading large, global, cross-functional engineering or manufacturing technology organizations.
- Demonstrated mastery of PCB technology development including laminate systems, interconnect structures, HDI/multilayer stackups, fabrication processes, and reliability engineering.
- Proven experience managing and developing global PCB supply bases, including technology roadmaps, qualifications, quality programs, capacity strategies, and supplier performance management.
PREFERRED QUALIFICATIONS
- * Experience with high-reliability sectors (Automotive, Aerospace, Defense, Medical) and their demanding process control and reliability requirements is a strong advantage.
- * Solid hands-on background in PCBA/SMT manufacturing, spanning solder materials, adhesives, underfill, thermal materials, stencil/reflow processes, DFM/DFT, SPC, failure analysis, and high-reliability assembly.
- * Demonstrated ability to partner with Hardware, Signal Integrity, and Reliability Engineering teams across domestic and global locations to address complex design-to-build challenges.
- * Proven executive-level leadership with clear communication, decisive problem-solving, and the ability to influence senior stakeholders in Engineering, Operations, and Supply organizations.
- * A motivated, analytical, and creative mindset with a passion for developing cutting-edge technologies and driving global manufacturing capability.
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