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Senior Package Design Engineer – Semiconductor PackagingJobot • Santa Clara, CA, US
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Senior Package Design Engineer – Semiconductor Packaging

Senior Package Design Engineer – Semiconductor Packaging

Jobot • Santa Clara, CA, US
30+ days ago
Salary
$150,000.00 yearly
Job type
  • Full-time
Job description

Hybrid This Jobot Job is hosted by: Madeline Lazarus Are you a fit? Easy Apply now by clicking the "Quick Apply" button and sending us your resume. Salary: $150,000 - $300,000 per year A bit about us: We are a leading AI semiconductor company developing high-performance computing technology that is redefining the future of artificial intelligence. Our engineering teams are building advanced processors, software platforms, networking solutions, and semiconductor technologies from the ground up while fostering a highly collaborative environment focused on innovation and solving technically demanding challenges. Why join us? Work on some of the industry's most advanced AI semiconductor programs. Collaborate directly with world-class silicon, package, SI/PI, and systems engineers. Gain exposure to emerging packaging technologies including chiplets and 2.5D integration. Influence package architecture during early design phases rather than production support. Join a rapidly growing engineering organization tackling next-generation computing challenges. Job Details We're seeking an experienced Package Design Engineer to support early-stage semiconductor package development through package-board co-design activities. You'll develop routing studies, board design mockups, and electrical modeling collateral used to optimize package architecture, BGA implementation, and overall system performance. Location: Santa Clara, CA • Hybrid • Minimal travel What you will be doing: · Create PCB routing studies supporting package development · Develop board-level design mockups for electrical modeling · Perform package escape routing and BGA optimization studies · Analyze routing congestion and layer utilization · Support Signal Integrity and Power Integrity modeling · Build representative PCB environments for package evaluation · Collaborate with package, SI/PI, mechanical, and systems engineering teams · Evaluate design tradeoffs during early architecture phases · Contribute automation and workflow improvement initiatives · Support advanced package-board co-design activities Must have skills: · 3+ years using Cadence Allegro PCB Designer · Experience with high-pin-count BGA layouts · Strong PCB routing expertise · Understanding of package escape strategies · Knowledge of Signal Integrity fundamentals · Knowledge of Power Integrity fundamentals · Experience with complex, high-speed interconnects · Strong cross-functional communication skills · Comfortable working through ambiguous engineering challenges · Interest in AI-driven engineering automation Interested in hearing more? Easy Apply now by clicking the "Quick Apply" button. Jobot is an Equal Opportunity Employer. We provide an inclusive work environment that celebrates diversity and all qualified candidates receive consideration for employment without regard to race, color, sex, sexual orientation, gender identity, religion, national origin, age (40 and over), disability, military status, genetic information or any other basis protected by applicable federal, state, or local laws. Jobot also prohibits harassment of applicants or employees based on any of these protected categories. It is Jobot’s policy to comply with all applicable federal, state and local laws respecting consideration of unemployment status in making hiring decisions. Sometimes Jobot is required to perform background checks with your authorization. Jobot will consider qualified candidates with criminal histories in a manner consistent with any applicable federal, state, or local law regarding criminal backgrounds, including but not limited to the Los Angeles Fair Chance Initiative for Hiring and the San Francisco Fair Chance Ordinance. Information collected and processed as part of your Jobot candidate profile, and any job applications, resumes, or other information you choose to submit is subject to Jobot's Privacy Policy, as well as the Jobot California Worker Privacy Notice and Jobot Notice Regarding Automated Employment Decision Tools which are available at jobot.com/legal. By applying for this job, you agree to receive calls, AI-generated calls, text messages, or emails from Jobot, and/or its agents and contracted partners. Frequency varies for text messages. Message and data rates may apply. Carriers are not liable for delayed or undelivered messages. You can reply STOP to cancel and HELP for help. You can access our privacy policy here: jobot.com/privacy-policy

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Senior Package Design Engineer – Semiconductor Packaging • Santa Clara, CA, US

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