Mechanical Engineer

Qualifications:

• Bachelor's degree in Mechanical Engineering
• 5-10 years of experience designing enclosures and packaging solutions for RF/Microwave systems and amplifiers, transceivers
• Proficiency in SolidWorks, SolidWorks Simulations or other FEA thermal analysis tools
• Experience designing heat sinks, thermal interfaces, and convective/conductive cooling solutions
• Knowledge of RF shielding design for RFI/EMI environments, connector integration, and electrical-mechanical interfaces
• Ability to work on outdoor and space-qualified applications with associated environmental and reliability requirements
• Experience with harsh environment requirements and space/aerospace standards
• Strong problem-solving and cross-functional collaboration skills

Responsibilities:

• Design enclosures and thermal management solutions including heat sinks and cooling architectures for mmWave RF/Microwave products
• Develop packaging and enclosure designs for integrated circuits and front-end modules with RF shielding and connector integration
• Perform thermal analysis and FEA to validate designs meet performance and reliability requirements
• Collaborate with electrical and RF engineers to optimize mechanical designs for RF performance and thermal management
• Support product development from concept through production for outdoor and space-qualified applications